Analysis of MPI5G mobile phone antenna soft board solder paste laser soldering
The 5G application terminal is a smart phone. With the development of mobile communication from 1G to 5G, the frequency of radio waves gradually increases, the wavelength becomes shorter and shorter, and the antenna becomes shorter and shorter. The higher the frequency and the shorter the wavelength of the electromagnetic wave, the easier it is to attenuate in the propagation medium. The higher the frequency, the smaller the loss of the antenna material. PI film (polyimide) is used as the antenna manufacturing material in G era, but at the above frequency of 10Ghz, the temperature change caused by heat accumulation will lead to antenna deformation, transmission loss, waveform distortion, affect the transmission speed, and cannot meet the needs of 5G antenna, and MPI (modified polyimide) can improve this situation.
MPI material introduction
MPI (Modified Polyimide) is an improved polyimide, an amorphous material, which can be operated at various temperatures, especially when pressing copper foil at low temperature, and can easily connect with the surface of copper. MPI improves PI through the formulation of PI high-performance fluoride. The dielectric constant, hygroscopicity and transmission loss of MPI are between PI and LCP. The 10-15GHz high frequency signal processing can meet the signal processing requirements of the 5G era.
Antenna MPI laser welding soft board
As a new material of 5G mobile phone antenna, MPI soft board is becoming more and more complex in the manufacture and use of mobile phone antenna. Laser welding will have many advantages. The laser solder paste welding system has the characteristics of high energy, high precision and high directionality. It can effectively control the processing environment, avoid the damage caused by the high processing temperature to the product, perfectly solve the problems such as the scald of the insulation layer in the soldering iron head welding, greatly improve the processing rate, effectively solve the welding difficulties of the antenna module, and provide strong processing support for the development of precision and automation of the product.
Solder paste laser welding system
The laser welding process is divided into two steps. First of all, the solder paste needs to be heated, and the solder joint also needs to be preheated. After welding, the solder paste used is completely melted, and the solder pad is completely wetted, finally forming welding. Automation Technology (Shanghai) Co., Ltd. is a high-tech equipment R&D and manufacturing enterprise. As a very successful automation equipment manufacturer in the early development and application of the domestic solder paste laser welding industry, the current successful solder paste laser welding system is applicable to camera modules, VCM voice coil motors, FPCs, connectors, antennas, sensors, inductors, hard disk heads, loudspeakers, inductors, hard disk heads, speakers, optical communication elements, thermal elements, photosensitive elements, etc. The shortest welding time can reach 0.3 seconds, which is very suitable for the field of precision laser welding of 5G antenna module MPI soft plate.
